Embedded Systems and Design & Development - Feb 16, 2026 | Morning | VisionAstraa EV Academy

Embedded Systems & EV Design — VisionAstraa EV Academy

Session: Feb 16, 2026 (morning)

High-level focus

This course section covered automotive embedded architecture as it applies to electric vehicles (EVs): how controllers, software stacks, power electronics and domain/zonal architectures connect to form modern EV systems.

Software / embedded stack (what to learn)

• MCU as the basic control element — program MCUs to enable vehicle functions.
• AUTOSAR-like Basic Software (BSW) layers:
  • Service layer
  • ECU Abstraction layer
  • Microcontroller Abstraction layer
• Complex Device Drivers (CDD) sit between the AUTOSAR Runtime Environment (RTE) and hardware to invoke lower-level functions.
• Real-time call flow: application layer → RTE → CDD → hardware/ECU.
• Evolution of compute:
  • Hobby/legacy MCUs (Arduino, 8051)
  • Industry ECUs
  • High-performance multi-core SoCs (ARM Cortex multi-core, GPUs, DSPs) used in domain controllers / centralized compute

Vehicle hardware & powertrain

• Main EV components:
  • Battery (DC chemical energy) and Battery Management System (BMS)
  • Traction inverter and motor
  • Power Distribution Unit (PDU)
  • Motor controller / Vehicle Control Unit
  • Onboard charger (OBC)
  • Auxiliary power (e.g., buck converters: 48V → 12V)
• Key EV differences vs ICE vehicles:
  • Far fewer moving parts
  • No multi-gear dependency; throttle maps directly to motor torque/speed
• Energy losses that affect efficiency and range:
  • I^2R (resistive) losses
  • Eddy current losses
  • Transmission losses

Power electronics, charging and converters (technical points)

• OBC / charging chain overview:
  • AC grid → PFC/rectifier → DC link → DC‑DC or inverter → battery charging
  • Bidirectional capability noted (V2G, V2L)
• Converter topologies mentioned:
  • Bridgeless totem‑pole PFC (high efficiency, uses MOSFETs)
  • Buck / boost DC‑DC converters for step‑down / step‑up
  • Dual Active Bridge (DAB) for bidirectional DC‑DC
  • Inverter for DC→AC to drive AC motors
• Semiconductors:
  • Emphasis on wide‑bandgap devices (SiC MOSFETs, GaN)
  • Benefits: higher efficiency at high voltage (e.g., ~800 V) and switching frequency
  • Design demands: gate drive, layout, thermal management
• Practical circuit topics:
  • Rectification and active rectification / ideal diodes (lower loss than standard diodes)
  • Use of MOSFETs to reduce conduction and switching losses

Design challenges & practical solutions

• Paralleling SiC MOSFETs:
  • Current imbalances due to Vth differences
  • Mitigations: precise binning, Kelvin source connections, careful gate loop decoupling
• Gate driver and protection:
  • Manage spikes (active clamping), reliable gate driving, negative bias and detection strategies, gate‑drive isolation
• Signal integrity and isolation:
  • Use level shifters and digital isolators between low‑voltage MCU (e.g., 3.3 V) and high‑side gate drivers
• Low‑voltage efficiency:
  • Use active rectification / ideal diode techniques to avoid diode losses
• Thermal and packaging:
  • Copper‑clip / LF pack / CFP instead of wire‑bond for superior thermal dissipation and lower resistance
• Simulation recommendation:
  • Model and test DAB and converter topologies in MATLAB/Simulink

Architecture trends and connectivity

• Evolution of ECU architecture:
  • Historically many distributed ECUs and heavy wiring
  • Domain controllers (2000s–2010s) as a nervous-system approach
  • Centralized/zonal architectures post‑2020 for further consolidation
• Zonal architecture advantages:
  • Significant weight reduction (up to ~50% reduction in copper cabling)
  • Localized power distribution and simplified harnessing
  • Easier manufacturing automation and better fault containment
• In-vehicle communications:
  • CAN, CAN‑FD (higher data rates), FlexRay
  • Gigabit Ethernet for high throughput and centralized compute
• Safety & security:
  • ISO 26262 (functional safety)
  • ISO 21434 (automotive cybersecurity)
  • Hardware security: encrypted boards, secure key storage
• Power management:
  • PMICs supply low rails (e.g., 0.8–5 V) for SoC and peripherals
  • PMIC controllers manage sequencing and power domains

Takeaway summary

• Embedded software (AUTOSAR/BSW/RTE) and power electronics are tightly interdependent and together shape EV function and efficiency.
• Future EVs rely on high‑performance SoCs, robust PMICs, safe and secure hardware design, and modern communication/zonal architectures.
• Practical design focus areas:
  • Handling SiC/GaN devices
  • Gate driver design and protection
  • Thermal packaging and advanced interconnects
  • Active rectification / ideal diodes
  • Bidirectional power flow (V2G/V2L)
  • Converter simulation (MATLAB/Simulink)

Suggested study / tutorial items

• AUTOSAR basics: BSW layers, CDD, RTE
• Power electronics topologies: bridgeless totem‑pole PFC, DAB, buck/boost, inverters
• SiC MOSFET paralleling techniques and gate‑driver design
• Active rectification and ideal diode implementation
• MATLAB/Simulink modeling of converter circuits
• ISO 26262 and ISO 21434 standards
• PMIC design and SoC power sequencing

Main speakers / sources referenced

• Instructor: Bajira (primary presenter)
• Other referenced / earlier instructors: Punar, Punit, Puniter (battery, motor, EV architecture topics)
• Supporting staff / to join later: Yusur and Nikil (Nikil sir)

Note: Subtitles were auto-generated; some names/words in the transcript may be slightly mis-transcribed.